A plastic microchip is disclosed. The plastic microchip according to examples of the present invention enables a bonding material to be quickly and uniformly diffused along a bonding surface so as to accurately and easily bond an upper substrate and a lower substrate, maintain a shape of a bonding part when separating an injection-molded article from a mold so as to minimize a design error of a channel height, and prevent the bonding material from leaking inside a space of a bonding jig or a sample charging part, thereby improving product productivity and reliability.
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Published patent application
Disclosure date: 05-14-2015
Publication date: 04-12-2017
Applicant: NANOENTEK INC, KR
Inventor: HUR DAE-SUNG, KR ; KIM JAE-JEONG, KR ; KIM YU-RAE, KR
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