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09-09-2015

Cover Layer with High Thermal Resistance and High Reflectivity for a Printed Circuit Board

A cover layer (10) of a printed circuit board has a polymer film (11), a reflective composite layer (12) and an adhesive layer (13). The polymer film (11) has a melting point greater than 260°C. The reflective composite layer (12) is mounted on one side surface of the polymer film (11) and has a first reflective pigment. The adhesive layer (13) is mounted on another side surface of the polymer film (11). Also, at a range of wavelength where a reflectivity of the cover layer (10) is greater than 89%, absorption of the polymer film (11) to the same range of wavelength is less than 35%. The cover layer (10) is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160°C to 320°C, the cover layer (10) has a reflectivity over 89% without yellowing and delamination.

Document: EP2916628A1
Click here for the full patent text at DEPATISnet [PDF]
Published patent application
Disclosure date: 03-07-2014
Publication date: 09-09-2015
Applicant: TAIFLEX SCIENT CO LTD, TW
Inventor: HUNG TZU-CHING, TW ; LEE YU-HSIEN, TW ; LU CHEN-KUO, TW ; SHIH YU-CHEN, TW ; TIEN FENG-JUNG, TW ; WU SU-PING, TW


© European Patent Office. This information was obtained from the espacenet of the European Patent Office. There is no guarantee of its correctness or curency. For additional information, please use the research at espacenet. It is possible to determine the current legal and procedural status of patents and utility patents/models at http://worldwide.espacenet.com/ kfree of charge.

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