Cover Layer with High Thermal Resistance and High Reflectivity for a Printed Circuit Board
A cover layer (10) of a printed circuit board has a polymer film (11), a reflective composite layer (12) and an adhesive layer (13). The polymer film (11) has a melting point greater than 260°C. The reflective composite layer (12) is mounted on one side surface of the polymer film (11) and has a first reflective pigment. The adhesive layer (13) is mounted on another side surface of the polymer film (11). Also, at a range of wavelength where a reflectivity of the cover layer (10) is greater than 89%, absorption of the polymer film (11) to the same range of wavelength is less than 35%. The cover layer (10) is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160°C to 320°C, the cover layer (10) has a reflectivity over 89% without yellowing and delamination.
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Published patent application
Disclosure date: 03-07-2014
Publication date: 09-09-2015
Applicant: TAIFLEX SCIENT CO LTD, TW
Inventor: HUNG TZU-CHING, TW ; LEE YU-HSIEN, TW ; LU CHEN-KUO, TW ; SHIH YU-CHEN, TW ; TIEN FENG-JUNG, TW ; WU SU-PING, TW
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