Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.
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Published patent application
Disclosure date: 04-18-2011
Publication date: 08-21-2013
Applicant: DENKI KAGAKU KOGYO KK, JP
Inventor: FUJIMURA TETSUO, JP ; SASAKI AKIRA, JP ; TOKUNAGA HISATSUGU, JP
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