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08-21-2013

Cover Film

Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.

Document: EP2628690A1
Click here for the full patent text at DEPATISnet [PDF]
Published patent application
Disclosure date: 04-18-2011
Publication date: 08-21-2013
Applicant: DENKI KAGAKU KOGYO KK, JP
Inventor: FUJIMURA TETSUO, JP ; SASAKI AKIRA, JP ; TOKUNAGA HISATSUGU, JP


© European Patent Office. This information was obtained from the espacenet of the European Patent Office. There is no guarantee of its correctness or curency. For additional information, please use the research at espacenet. It is possible to determine the current legal and procedural status of patents and utility patents/models at http://worldwide.espacenet.com/ kfree of charge.

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