Biosensor with Three-Dimensional Structure and Manufacturing Method thereof
The present invention relates to a biosensor which is formed with a three-dimensional structure using 3D molded interconnect device (MID) technology and a manufacturing method thereof. The present invention provides a biosensor in which reactive electrodes and signal transfer parts are formed in a three-dimensional structure on a surface of a polymer using the 3D MID technology, and a manufacturing method thereof.
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Published patent application
Disclosure date: 10-07-2011
Publication date: 08-14-2013
Applicant: CERAGEM MEDISYS INC, KR
Inventor: CHOI JAE KYU, KR ; KIM TAE HUN, KR ; LEE JIN WOO, KR
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