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08-14-2013

Biosensor with Three-Dimensional Structure and Manufacturing Method thereof

The present invention relates to a biosensor which is formed with a three-dimensional structure using 3D molded interconnect device (MID) technology and a manufacturing method thereof. The present invention provides a biosensor in which reactive electrodes and signal transfer parts are formed in a three-dimensional structure on a surface of a polymer using the 3D MID technology, and a manufacturing method thereof.

Document: EP2626700A2
Click here for the full patent text at DEPATISnet [PDF]
Published patent application
Disclosure date: 10-07-2011
Publication date: 08-14-2013
Applicant: CERAGEM MEDISYS INC, KR
Inventor: CHOI JAE KYU, KR ; KIM TAE HUN, KR ; LEE JIN WOO, KR


© European Patent Office. This information was obtained from the espacenet of the European Patent Office. There is no guarantee of its correctness or curency. For additional information, please use the research at espacenet. It is possible to determine the current legal and procedural status of patents and utility patents/models at http://worldwide.espacenet.com/ kfree of charge.

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