Analysis of temperature profiling with cover blades to increase the material efficiency in thermoforming
In the thermoforming process, an uneven deformation of the film is characteristic, whereby thin areas in the product arise with lower strengths. Therefore, the parts to be produced have to be dimensioned with respect to these thin places, whereby the parts are oversized in all remaining areas. With the aim to optimise the forming properties of the film, a temperature profile of the film through a heating concept with cover blades is applied. It is possible to adjust the deformation behavior of film products locally so that the used material is stretched equally which avoids this spots and overengineered part areas. Thus, film thickness can be reduced at constant part properties.
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