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Hot Stamping of Molded Interconnect Devices

The Hot Stamping Process of thermoplastic substrates allows for the construction of highly adhesive conductor patterns via the shearing of a copper stamping foil when pressed with a heated stamping die. New adhesive-free copper foils were utilized in which the roughened surface enables a mechanical adhesion to the plastic substrate. The significant variables that influence the adhesion of the stamping foil to semicrystalline (PBT, PA66-GF, PP-GF) and amorphous (ABS) plastics are shown.

The most important prerequisite for high adhesive properties is the adequate wetting of the roughened foil surface by the molten plastic. The most decisive variable for the wetting quality is the stamp temperature, whereas an increase in both the stamping pressure and time were found less significant. The maximum operational temperature during stamping is limited by the excessive buildup of plastic beads that will ultimately hinder the formation of fine conductor line widths. For the investigated plastics, processing windows are defined which consider the flawless foil shear with regard to the conductor pattern, as well as both the adhesive demands and the size of the plastic bead.

After the application of thermal an environmental loading which assimilates conditions observed during soldering and use, the adhesive properties become altered with respect to the plastic type and the magnitude of the load. For non-reinforced plastics that exhibit a high thermal expansion, the possible failure of the conductors during thermal loading should be considered.

Lesen Sie die deutsche Zusammenfassung auf Kunststoffe.de
Author
 Stefan Stampfer

Stefan Stampfer
Lehrstuhl für Kunststofftechnik (LKT)
Universität Erlangen-Nürnberg

Information

Free keywords: Molded Interconnect Device, MID, Hot Stamping, Copper Foil, Adhesive Strength, Surface Tension, Aging
Institute / chair: Technische Fakultät der Universität Erlangen-Nürnberg
Language: German
Technical consultant for expert services: Prof. Dr.-Ing. Dr. h.c. Gottfried W. Ehrenstein (Betreuer), Prof. Dr.-Ing. Klaus Feldmann
Publication year: 1999
Provider: Wissenschaftlicher Arbeitskreis Kunststofftechnik (WAK) / Kunststoffe.de

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