Primaset Ultra-Low Loss and High Temperature Thermoset Materials
For Telecommunication Industries and Bendable Electronic Devices
Novoset, LLC, Peapack, NJ/USA, and Lonza Ltd., Basel, Switzerland, cooperated to introduce the Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.
These thermoset resins are based on Cyanate ester (CE) chemistry. Primaset ULL-950 is suitable for high-performance applications such as power amplifiers for 4G LTE and 4G LTE advanced base stations for smartphones, internet infrastructure and high-layer count servers for “cloud computing”. Depending on the backbone structure Primaset ULL-950 has a dissipation factor (Df ) ranging from 0.0009 to 0.003 and dielectric constant (Dk ) between 2.3 - 2.6 up to 40 GHz. The Glass transition temperature (Tg ) can vary between 175 - 320˚C. High temperature bendable devices can be fabricated utilizing its flexibility.
Low dielectric properties coupled with high Tg makes Primaset HTL-300 an ideal candidate for advanced Integrated Circuit (IC) substrates for semiconductor packaging materials and next generation application processors for mobile chips.
These products also exhibit low moisture uptake and short lamination cycles. The high temperature capabilities and toughness are critical for lead-free assemblies in Printed Circuit Boards (PCB) and build-up films. Low moisture uptake and wet Tg retention with toughness also may open the door for the use of these Cyanate esters for structural aerospace applications. The processing of these materials is similar to epoxy resins and other commercial Primaset materials. They co-react with epoxy resins, Polyphenylenether (PPE), Styrene maleic anhydride (SMA), Triallyl cyanurate (TAC), Bismaleinimide (BMI), Vinyl polymers, Primaset BA-230S, Primaset BA-3000, and other Cyanate esters. The products are soluble in Methyl ethyl ketone (MEK), Toluene, Xylenes and other solvents at high concentration. These products also give excellent adhesive characteristics with various substrates and can be highly filled with fillers for low CTE applications.
ULL-950 and HTL-300 were developed at Novoset Technology Center, in Berkeley Heights, NJ/USA. Lonza will manufacture and market these two products globally under the Primaset trade name.
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