Wide Range of Applications
In the Hostaform product range, K. D. Feddersen GmbH & Co KG, Hamburg, Germany, offers application-specific compounds for polyoxymethylene (POM). Thus, the grade XGC is characterized by improved glass fiber-matrix adhesion and is suitable for use in the temperature range -40 °C to 90 °C due to its very low creep tendency. The low friction and low wear of SlideX confer good sliding friction properties. MetalX is an additive which bestows a metallic look and eliminates the need for painting.
Polypropylene components can be made lighter with the Hostacom line. This includes both glass fiber-reinforced and unreinforced variants. The reinforced grade Advanced CoPo possesses very good creep resistance at temperatures above 120 °C. Reinforced grade ERG 393F and unreinforced Hifax compounds keep density low through foaming. Softell possesses a "soft touch" feel, without the need for additional painting and can also create leather-grain effects, including seam when the appropriate injection mold is used. Furthermore, it features high noise damping, superb colorability, and outstanding weld-line strength and impact strength.
Fortron Flex is a new range of extrusion and injection molding grades based on polyphenyl sulfide (PPS). These grades can be used for applications ranging from cable sheathing and pipes to automotive to applications under the hood.
Hall 6, booth B42
K.D. Feddersen GmbH & Co. KG
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