High-temperature polyamide Stanyl ForTii
With the development of the new, halogen-free, flame-retardant, high-temperature polyamide Stanyl ForTii (previously described as PA4T), DSM Engineering Plastics, Sittard, Netherlands, is extending its portfolio of high-performance engineering thermoplastics. The property profile of ForTii is very balanced, combining excellent dimensional stability and suitability for lead-free resoldering with very high stiffness and mechanical strength at extreme temperatures. In addition, the product offers a wide processing window and high flowability.
This new high-temperature polyamide enhances the present range of Stanyl products from DSM. It meets the requirements for lead-free soldering of surface mount devices (SMD), such as circuit boards used in personal computers, and also takes account of the current trend towards halogen-free electronics. It facilitates the progressive miniaturization of components to achieve higher data transfer rates and bundled functionality such as cell telephony, GPS navigation and increased processing power.
Its specific balance of characteristics make ForTii highly suitable for electronics applications such as memory card connectors or notebook computer memory module connectors, where other materials, such as liquid crystal polymers (LCP), increasingly face warpage problems. In the automotive sector, Stanyl ForTii will be able to support new developments in under-the-hood automotive electronics as well as in air/fuel system and powertrain components. In the lighting industry, customer trials have shown that the material is very suitable for LED housings and modules thanks to its high reflectivity and exceptional thermal stability.
DSM Engineering Plastics BV
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