back to top
My wish lists
Save your wish list
If you want to add more content to your wish list, simply log in. If you do not have a user account, please register for the Hanser Customer Center.

» Do you already have a user account? Please log in here.
» Don't have a user account yet? Please register here.
Your wish lists
If you want to use your wish list during your next visit, simply log in. If you do not have a user account, please register for the Hanser Customer Center.
» Do you already have a user account? Please log in here.
» Don't have a user account yet? Please register here.

« Back

Your advantages at a glance

  • One login for all Hanser portals
  • Individual home page for faster access to preferred content
  • Exclusive access to selected content
  • Personal wish lists on all portals
  • Central management of your personal information and newsletter subscriptions

Register now
Deutsch
Bookmark Bookmarked
06-10-2009

High-temperature polyamide Stanyl ForTii

Good Balance

High-temperature polyamide Stanyl ForTii

With the development of the new, halogen-free, flame-retardant, high-temperature polyamide Stanyl ForTii (previously described as PA4T), DSM Engineering Plastics, Sittard, Netherlands, is extending its portfolio of high-performance engineering thermoplastics. The property profile of ForTii is very balanced, combining excellent dimensional stability and suitability for lead-free resoldering with very high stiffness and mechanical strength at extreme temperatures. In addition, the product offers a wide processing window and high flowability.

This new high-temperature polyamide enhances the present range of Stanyl products from DSM. It meets the requirements for lead-free soldering of surface mount devices (SMD), such as circuit boards used in personal computers, and also takes account of the current trend towards halogen-free electronics. It facilitates the progressive miniaturization of components to achieve higher data transfer rates and bundled functionality such as cell telephony, GPS navigation and increased processing power.

Its specific balance of characteristics make ForTii highly suitable for electronics applications such as memory card connectors or notebook computer memory module connectors, where other materials, such as liquid crystal polymers (LCP), increasingly face warpage problems. In the automotive sector, Stanyl ForTii will be able to support new developments in under-the-hood automotive electronics as well as in air/fuel system and powertrain components. In the lighting industry, customer trials have shown that the material is very suitable for LED housings and modules thanks to its high reflectivity and exceptional thermal stability.

Company profile

DSM Engineering Plastics BV

Tel.: +31 46 4773270
Fax: +31 46 4770400

These articles might be interesting for you
Patents Stimulate Innovation

Patents encourage innovation: Stay on the ball with the latest innovations in the plastics industry in our patents section.

Patents

Newsletter

Would you like to subscribe to our Newsletters on plastics technology and profit from the latest information?

Subscribe here

Subscribe here

Trade Names

You know the trade name but want to know the material manufacturer, type of polymer and delivery form? Search here!

Trade Names