Temperature Profiling Increases Material Efficiency
By temperature profiling the thermoforming sheet, the wall thicknesses of the resulting molded parts can be varied, thereby leading to material savings of up to 20 %. Together with Watttron GmbH in Freital, Germany, the Fraunhofer Institute for Process Engineering and Packaging IVV in Dresden, Germany, will show a test setup fitted with a Cera2heat heating system consisting of small, square, flat heating circuits that heat the thermoforming sheet selectively and inhomogeneously by contact.
Hall 8a, booth F11-3
Fraunhofer-Institut für Verfahrenstechnik u Verpackung IVV
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