High-Performance Polyamide ForTii Eco
High Temperature-Resistant and Bio-Based
Royal DSM is extending its range of high temperature resistant bio-based polymers with the introduction of a new family of high performance polyamide 4T materials, partially produced from renewable resources, called ForTii Eco. These new materials fit with the growing need of faster, thinner and more sustainable devices in the electronics industry.
On average, smart phones are getting 12% thinner every year, while speed and functionality continue to increase. At the same time there is a growing demand from society for more sustainable devices. The new ForTii Eco grades enrich DSM's current bio-based platform, and additionally provide increased performance compared to alternative mineral oil-based solutions.
DSM ForTii Eco grades represent the next generation of high temperature polyamides. They are able to meet more stringent requirements on properties like flow, mechanical and dielectrical strength than has been possible even with “existing” ForTii grades, which already exhibit performance outperforming with other polyamides. The polymer in the new grades is 30-60% derived from renewable resources. DSM uses castor beans as the basis for the C10 chemistry that it incorporates. The grades have a bio-content ranging from 10% to 25% by weight on a compound basis.
The first three grades in the family are ForTii Eco E11, ForTii Eco E61 and ForTii Eco LDS62. They will provide halogen-free solutions for parts with thinner walls and demonstrate very good flow together with excellent mechanical and dielectrical properties. Key applications for ForTii Eco E11 and ForTii Eco E61 include surface-mount technology (SMT) connectors, like the new USB-C, and also audio jacks; ForTii Eco LDS62 is highly suitable for antennas, RFID security casings, and switches found in many portable electronic devices.
ForTii Eco shows low sensitivity to moisture, which ensures that its outstanding mechanical and dielectrical properties are retained even in the conditioned state. Toughness is also high. These new grades offer higher flow and an improved processing window, combined with high toughness and full resistance to high temperature soldering. Competing semi-aromatic polyamides such as PA6T and PA10T have lower flow and lower toughness (to varying extents).
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