Low Dielectric Loss Copper Clad Laminate Formulation
For Printed Circuit Boards
FRX Polymers, Inc., Chelmsfored, MA/USA, global supplier of polymeric halogen-free flame retardant solutions, and China’s Shengyi Technology Company have jointly developed a new copper clad laminate (CCL) product with greatly improved dielectric properties compared to current commercial halogen-free systems in the market today.
The new CCL is in the low loss region (0.005 – 0.010) with accompanying low dielectric constant. It utilizes FRX Polymer’s Nofia flame retardant hardener and is expected to find initial applications in the smart phone and server segments of the printed circuit board market.
In addition to its excellent electrical properties, the product also has high modulus, very low coefficient of thermal expansion, very good peel strength, outstanding pressure cooker resistance, and a strong UL 94 V-0 rating in the flammability test.
Nofia phosphonates, FRX Polymers’ polymeric halogen-free flame retardant solution, replace halogenated flame retardants, which are being phased out due to toxicity concerns. Nofia products have undergone extensive toxicology testing, received a favorable toxicological profile, and have consequently been registered globally. They are produced using sustainable green chemistry principles such as a solvent-free production process, no waste by-products, and near 100% atom efficiency.
FRX Polymers, Inc.
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