Husky Hosted Beverage Packaging Conference

Husky World Tour Luxembourg: Attendees gather around Husky’s new HyPET HPP 5.0 system (figure: Husky)
On September 12, 2013, Husky Injection Molding Systems hosted its European Beverage Packaging Conference, a major stop on its year-long World Tour. Held at its EMEA headquarters in Dudelange, Luxembourg, the event was attended by more than 90 business leaders from around the world and showcased Husky’s broad range of solutions for preform and closure manufacturing.
According to John Galt, Husky’s President and CEO, the company has been able to gather valuable customer feedback, as well as communicate its strategy as a long-term beverage packaging partner, which is to help its customers maximize productivity, reduce waste and streamline their operations by providing complete solutions for all applications and volumes.
The conference included focused customer meetings, facility tours, networking opportunities, product demonstrations and presentations from Husky and industry experts. One highlight of the event was an exclusive preview demonstration of Husky’s next generation HyPET High Performance Package (HPP) 5.0 system, which will be officially launching before the end of the year. The HyPET HPP 5.0 400 system produced a 22.26 g preform for a 500 mL aseptic juice application, running an 8.1 s cycle time and using resin supplied by Indorama.
The Husky World Tour 2013 is a series of global customer events that have taken place throughout the year in the Americas, Europe, the Middle East and Asia Pacific. With multiple local events spanning the globe, the tour gives current and prospective customers more direct access to Husky’s latest technologies at a local level while providing targeted solutions to help customers reduce variability, improve part cost and increase productivity. Final events for the year include a Specialty Closures Conference in Shanghai, China on November 5, as well as a Hot Runner Conference in Milton, Vermont on November 20.
Husky Injection Molding Systems Ltd.
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