Husky Awarded Ringier 2012 Technology Innovation Award
Husky Injection Molding Systems has been recognized with the Ringier 2012 Technology Innovation Award. The company received the award for the development of its HyPET High Performance Package (HPP) injection molding system and its contributions to the packaging industry in China. The award was presented to Husky representatives on July 19, 2012 in a special ceremony that took place during the ProPak China 2012 tradeshow in Shanghai.
The HyPET HPP system is specifically optimized for high output preform injection molding. The system delivers industry-leading cycle times and increased energy efficiency, while maintaining the highest levels of reliability, repeatability and preform quality. Refinements to the entire system can reduce cycle times by at least 5 % in comparison to previous industry-leading HyPET HPP cycles, as well as improve energy efficiency by up to 15 % in comparison to standard HyPET systems.
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