Asiamold Concludes with Record-Breaking Attendance
Asiamold concluded its ninth edition on a positive note. Held from 15–17 September at Guangzhou’s China Import and Export Fair Complex, the fair once again demonstrated its significance within the mold and additive manufacturing sector. The show continues to serve as an important sourcing platform for mold, die and additive manufacturing in China.
The fair attracted 320 exhibitors from Belgium, Germany, Hong Kong, India, Japan, Korea, Taiwan, Turkey and the US. The event also welcomed 21,776 professional buyers, a 14.5% increase from the previous edition, from 48 countries and regions. Contributing to the impressive visitor figures this year were 65 buyer delegations from companies such as Colgate, Epson, FAW-Volkswagen, Osram, Emerson, Foxconn, Honda, BYD, Gree Electic, Unipres, Midea, Esquel and others. The increasing number of visitors affirms the importance of Asiamold to the manufacturing industry, its growth and promising future developments.
A successful show highlight was the 3-D Printing Asia Zone. Due to growing demand for higher precision technologies coupled with tighter research and development budgets and times, the value of 3-D printing technologies has never been greater. Visitors praised the growing number of 3-D printing companies attending the show and sharing their expertise. Furthermore, the 2015 edition of Asiamold featured over 30 high-level seminars addressing a variety of hot-button issues affecting the mold making, 3-D printing, die casting and metalworking industries.
Asiamold is organized by Guangzhou Guangya Messe Frankfurt in cooperation with formnext and Intermold Japan. formnext is Mesago Messe Frankfurt GmbH’s international exhibition and conference on additive technologies and tool making. The inaugural show will be held from 17–20 November 2015 in Hall 3 of the Frankfurt exhibition grounds. The next edition of Intermold Japan will be held from 20–23 April 2016 at Intex Osaka. The next edition of Asiamold is scheduled to take place from 20–22 September 2016.
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