Process Optimization: Throwing Light on Electronics Encapsulation
Fiber optic Bragg gratings and innovative sensors for internal mold pressure are enabling load analysis of pivotal steps in the processing of electronics encapsulation. They are relevant not just for injecting the polymer, but also for demolding and even for materials shrinkage. When combined with numerical simulation, they also provide insights into polymer behavior during reliability tests.Beitrag auf Deutsch lesen
International Polymer Processing, the journal of the Polymer Processing Society, is a discussion forum for the world-wide community of engineers and scientists in the field of polymer processing.
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