Foam Gasketing and Potting on a Miniature Scale
Micro Sealing of Electronic Components under ESD-Compliant Conditions
At a time of Industry 4.0 and self-driving cars, the amount of complex, highly sensitive electronics packed into ever smaller components is increasing. To protect these components from adverse environmental influences and ensure the longest possible, fault-free operation, they are gasketed, glued or potted. Specific procedures are stored for ESD-compliant contract manufacture of each different component.Beitrag auf Deutsch lesen
Sonderhoff Holding GmbH
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