Managing the Smallest Melt Volumes
Influencing Melt Flow when Molding Thin-Walled Electronic Components in High-Performance Polyamide Resins
Thermoplastic materials must prove their fit in ever smaller and powerful electronic components. A more detailed investigation was carried out focusing on the melt compression experienced when USB-C connectors are injection molded in polyamide resins, as it has shown to have a significant effect on melt flow and is an important factor in thin-wall component molding.Beitrag auf Deutsch lesen
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